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845-045-525-603 Технические параметры
EDAC 845-045-525-603 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Card Edge Connectors - Edgeboard Connectors | |
| Марка | EDAC | |
| Mounting Type | Through Hole | |
| Contact Plating | Gold | |
| Housing Material | Diallyl Phthalate (DAP) | |
| Material - Insulation | Diallyl Phthalate (DAP) | |
| Package | Bulk | |
| Base Product Number | 845-045 | |
| Mfr | EDAC Inc. | |
| Product Status | Active | |
| Contact Materials | Copper Alloy | |
| Mounting Styles | Panel | |
| Operating Temperature | -40°C ~ 125°C | |
| Series | 845 | |
| Termination | Solder | |
| Number of Positions | 45Positions |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Color | Green | |
| Number of Rows | 1Row | |
| Gender | Female | |
| Contact Type | Cantilever | |
| Pitch | 0.100 (2.54mm) | |
| Contact Finish | Gold | |
| Card Type | Non Specified - Single Edge | |
| Read Out | Single | |
| Number of Positions/Bay/Row | 45Positions/Bay/Rows | |
| Flange Feature | Top Mount Opening, Floating Bobbin, 0.116 (2.95mm) Dia | |
| Mounting Angle | Vertical | |
| Features | - | |
| Contact Finish Thickness | 10.0µin (0.25µm) | |
| Card Thickness | 0.054 ~ 0.070 (1.37mm ~ 1.78mm) | |
| Board Thickness | 1.57 mm |
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