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895-005-525-107 Технические параметры
EDAC 895-005-525-107 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Card Edge Connectors - Edgeboard Connectors | |
| Марка | EDAC | |
| Mounting Type | Through Hole | |
| Contact Plating | Gold | |
| Housing Material | Polyphenylene Sulfide (PPS) | |
| Material - Insulation | Polyphenylene Sulfide (PPS) | |
| Package | Bulk | |
| Base Product Number | 895-005 | |
| Mfr | EDAC Inc. | |
| Product Status | Active | |
| Contact Materials | Copper Alloy | |
| Mounting Styles | Panel Mount | |
| Operating Temperature | -40°C ~ 125°C | |
| Series | 895 | |
| Termination | Solder | |
| Number of Positions | 5Positions |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Color | Black | |
| Number of Rows | 1Row | |
| Gender | Female | |
| Contact Type | Cantilever | |
| Pitch | 0.100 (2.54mm) | |
| Contact Finish | Gold | |
| Card Type | Non Specified - Single Edge | |
| Read Out | Single | |
| Number of Positions/Bay/Row | 5Positions/Bay/Rows | |
| Flange Feature | Flush Mount, Top Opening, Threaded Insert, M3 | |
| Product | Receptacles | |
| Mounting Angle | Vertical | |
| Features | - | |
| Contact Finish Thickness | 10.0µin (0.25µm) | |
| Card Thickness | 0.054 ~ 0.070 (1.37mm ~ 1.78mm) | |
| Board Thickness | 1.57 mm |
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