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- ICK BGA 23X23
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ICK BGA 23X23 Технические параметры
Fischer Elektronik ICK BGA 23X23 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Thermal - Heat Sinks | |
| Марка | Fischer Elektronik | |
| Mount | Adhesive | |
| Material | Aluminium | |
| Body Material | Aluminum | |
| Rad Hardened | No | |
| Product Depth (mm) | 23(mm) | |
| Device Cooled | BGA | |
| Fin Style | Pin Array | |
| Product Diameter (mm) | Not Required(mm) | |
| Dimensions | 23 x 23 x 6mm | |
| Package Type | BGA | |
| For Use With | Universal Square Alu | |
| Mounting | Conductive Adhesive, Conductive Foil | |
| RoHS | Compliant | |
| Rohs Code | Yes | |
| Manufacturer Part Number | ICKBGA23X23 | |
| Manufacturer | Fischer Elektronik GmbH & Co KG | |
| Part Life Cycle Code | Active |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Ihs Manufacturer | FISCHER ELEKTRONIK GMBH & CO KG | |
| Risk Rank | 5.53 | |
| Type | Passive | |
| Color | Black | |
| Depth | 23 mm | |
| Construction | FIN | |
| Reach Compliance Code | compliant | |
| Attachment Method | Adhesive | |
| Finish | Black Anodized | |
| Thermal Support Device Type | HEAT SINK | |
| Natural Thermal Resistance | 23 °C/W | |
| Device Used On | IC | |
| Thermal Resistance | 22K/W | |
| Product Length (mm) | 23(mm) | |
| Width | 23mm | |
| Height | 6mm | |
| Length | 23mm | |
| Product Height (mm) | 6(mm) | |
| REACH SVHC | No SVHC |
ICK BGA 23X23 Документы
- Datasheets9431d39a4ab78b3531f1dd77ea2ed9ea
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