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FDMM032G-CAB Технические параметры
FLEx FDMM032G-CAB technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory | |
| Марка | FLEx | |
| Package / Case | Axial | |
| Surface Mount | YES | |
| Supplier Device Package | Axial | |
| Number of Terminals | 8Terminals | |
| Package Style | UNCASED CHIP | |
| Number of Words Code | 32G | |
| Package Body Material | UNSPECIFIED | |
| Operating Temperature-Min | 0 | |
| Operating Temperature-Max | 70 | |
| Number of Words | 34359738368Words | |
| Package Code | DIE | |
| Package Shape | RECTANGULAR | |
| Package Description | CARD-8 | |
| Manufacturer Part Number | FDMM032G-CAB | |
| Manufacturer | Flexxon Pte Ltd | |
| Part Life Cycle Code | Contact Manufacturer | |
| Ihs Manufacturer | FLEXXON GLOBAL LTD | |
| Risk Rank | 5.78 | |
| Operating Temperature | -55°C ~ 150°C | |
| Series | RNX | |
| Packaging | Bulk | |
| Size / Dimension | 0.140 Dia x 0.420 L (3.56mm x 10.67mm) | |
| Tolerance | ±10% | |
| Part Status | Active |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Number of Terminations | 2Terminations | |
| Temperature Coefficient | ±200ppm/°C | |
| Type | NOR TYPE | |
| Resistance | 4.7 kOhms | |
| Composition | Metal Oxide Film | |
| Power (Watts) | 1W | |
| Technology | CMOS | |
| Terminal Position | UPPER | |
| Terminal Form | NO LEAD | |
| Number of Functions | 1Function | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | R-XUUC-N8 | |
| Failure Rate | -- | |
| Supply Voltage-Max (Vsup) | 3.6 | |
| Temperature Grade | COMMERCIAL | |
| Supply Voltage-Min (Vsup) | 2.7 | |
| Operating Mode | ASYNCHRONOUS | |
| Organization | 32GX8 | |
| Memory Width | 8 | |
| Memory Density | 2.7487790694e+11 | |
| Parallel/Serial | SERIAL | |
| Memory IC Type | FLASH CARD | |
| Programming Voltage | 2.7 | |
| Features | Flame Retardant Coating, High Voltage, Safety | |
| Height Seated (Max) | -- |
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