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XPC860TCZP66D4 Технические параметры

Freescale  XPC860TCZP66D4 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - FPGAs (Field Programmable Gate Array)
Марка Freescale
Surface Mount YES
Number of Terminals 357Terminals
Factory Pack QuantityFactory Pack Quantity 4000
Manufacturer Taiyo Yuden
Brand Taiyo Yuden
RoHS Details
Package Description BGA, BGA357,19X19,50
Package Style GRID ARRAY
Package Body Material PLASTIC/EPOXY
Package Equivalence Code BGA357,19X19,50
Operating Temperature-Min -40 °C
Supply Voltage-Nom 3.3 V
Reflow Temperature-Max (s) NOT SPECIFIED
Supply Voltage-Min 3.135 V
Rohs Code No
Manufacturer Part Number XPC860TCZP66D4
Clock Frequency-Max 66 MHz
Package Code BGA
Package Shape SQUARE
Part Life Cycle Code Transferred
Ihs Manufacturer MOTOROLA INC
Supply Voltage-Max 3.465 V
Risk Rank 5.69
Series MCAR
ECCN Code 3A001.A.3
Свойство продукта Значение свойства
HTS Code 8542.31.00.01
Subcategory Capacitors
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Pitch 1.27 mm
Reach Compliance Code unknown
JESD-30 Code S-PBGA-B357
Qualification Status Not Qualified
Power Supplies 3.3 V
Speed 66 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Halogen Free Not Halogen Free
Seated Height-Max 2.05 mm
Address Bus Width 32
Product Type Ceramic Capacitors
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Product Category Multilayer Ceramic Capacitors MLCC - SMD/SMT
Width 25 mm
Length 25 mm
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