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XPC860ENZP66C1 Технические параметры

Freescale Semiconductor  XPC860ENZP66C1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microcontrollers - Application Specific
Марка
Surface Mount YES
Number of Terminals 357Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description BGA, BGA357,19X19,50
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA357,19X19,50
Package Shape SQUARE
Свойство продукта Значение свойства
Package Style GRID ARRAY
Supply Voltage-Nom 3.3 V
JESD-609 Code e0
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1.27 mm
Reach Compliance Code unknown
JESD-30 Code S-PBGA-B357
Qualification Status Not Qualified
Power Supplies 3.3 V
Просмотр сходства

XPC860ENZP66C1 Документы

XPC860ENZP66C1 brand manufacturers: Freescale Semiconductor, Anli stock, XPC860ENZP66C1 reference price.Freescale Semiconductor. XPC860ENZP66C1 parameters, XPC860ENZP66C1 Datasheet PDF and pin diagram description download.You can use the XPC860ENZP66C1 Embedded - Microcontrollers - Application Specific, DSP Datesheet PDF, find XPC860ENZP66C1 pin diagram and circuit diagram and usage method of function,XPC860ENZP66C1 electronics tutorials.You can download from the Anli.