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XPC823ECZT66B2 Технические параметры

Freescale Semiconductor, Inc. (NXP Semiconductors)  XPC823ECZT66B2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microprocessors
Марка
Surface Mount YES
Number of Terminals 256Terminals
EU RoHS Not Compliant
ECCN (US) 3A991
SVHC Yes
SVHC Exceeds Threshold Yes
Automotive No
PPAP No
Family Name PowerPC MPC8xx Processor
Instruction Set Architecture RISC
Number of CPU Cores 1CPU Core
Data Bus Width (bit) 32
Maximum Speed (MHz) 66
Typical Operating Supply Voltage (V) 3.3
I/O Voltage (V) 3.3
Mounting Surface Mount
Package Height 1.65(Max)
Package Width 23
Package Length 23
PCB changed 256
Standard Package Name BGA
Supplier Package BGA
Lead Shape Ball
Package Description 23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA-256
Package Style GRID ARRAY
Package Body Material PLASTIC/EPOXY
Package Equivalence Code BGA256,23X23,50
Operating Temperature-Min -40 °C
Supply Voltage-Nom 3.3 V
Supply Voltage-Min 3 V
Rohs Code No
Свойство продукта Значение свойства
Manufacturer Part Number XPC823ECZT66B2
Clock Frequency-Max 5 MHz
Package Code BGA
Package Shape SQUARE
Manufacturer Motorola Semiconductor Products
Part Life Cycle Code Transferred
Ihs Manufacturer MOTOROLA INC
Supply Voltage-Max 3.6 V
Risk Rank 5.74
Part Status Obsolete
Subcategory Microprocessors
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1.27 mm
Reach Compliance Code unknown
Pin Count 256
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Power Supplies 3.3 V
Speed 66 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Seated Height-Max 2.35 mm
Address Bus Width 26
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Device Core PowerPC
Width 23 mm
Length 23 mm
Просмотр сходства
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