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XPC823EZT75B2 Технические параметры

Freescale Semiconductor, Inc. (NXP Semiconductors)  XPC823EZT75B2 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microprocessors
Марка
Surface Mount YES
Number of Terminals 256Terminals
EU RoHS Not Compliant
ECCN (US) 3A991
HTS 8542.31.00.01
SVHC Yes
SVHC Exceeds Threshold Yes
Automotive No
PPAP No
Family Name PowerPC MPC8xx Processor
Instruction Set Architecture RISC
Number of CPU Cores 1CPU Core
Data Bus Width (bit) 32
Maximum Speed (MHz) 75
I/O Voltage (V) 3.3
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95
Mounting Surface Mount
Package Height 1.65(Max)
Package Width 23
Package Length 23
PCB changed 256
Standard Package Name BGA
Supplier Package BGA
Lead Shape Ball
Package Description BGA,
Package Style GRID ARRAY
Package Body Material PLASTIC/EPOXY
Supply Voltage-Nom 3.3 V
Supply Voltage-Min 3 V
Свойство продукта Значение свойства
Operating Temperature-Max 70 °C
Manufacturer Part Number XPC823EZT75B2
Clock Frequency-Max 5 MHz
Package Code BGA
Package Shape SQUARE
Manufacturer Nexperia
Part Life Cycle Code Active
Ihs Manufacturer NEXPERIA
Supply Voltage-Max 3.6 V
Risk Rank 5.52
Part Status Obsolete
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1.27 mm
Reach Compliance Code compliant
Pin Count 256
JESD-30 Code S-PBGA-B256
Temperature Grade COMMERCIAL
Speed 75 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Seated Height-Max 2.35 mm
Address Bus Width 26
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Device Core PowerPC
Width 23 mm
Length 23 mm
Просмотр сходства
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