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XPC850ZT66BU Технические параметры
Freescale Semiconductor, Inc. (NXP Semiconductors) XPC850ZT66BU technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - Microprocessors | |
| Марка | ||
| Package / Case | BGA | |
| Surface Mount | YES | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 256Terminations | |
| Terminal Finish | TIN LEAD | |
| Max Operating Temperature | 95°C | |
| Min Operating Temperature | 0°C | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 220 | |
| Supply Voltage | 3.3V | |
| Reach Compliance Code | not_compliant | |
| Frequency | 66MHz | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Pin Count | 256 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 3.465V | |
| Power Supplies | 3.3V | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC | |
| Bit Size | 32 | |
| Halogen Free | Not Halogen Free | |
| Address Bus Width | 26 | |
| Boundary Scan | YES | |
| Low Power Mode | YES | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| Number of Cores | 1Core | |
| Length | 23mm | |
| Height Seated (Max) | 2.35mm | |
| Width | 23mm | |
| RoHS Status | Non-RoHS Compliant | |
| Lead Free | Contains Lead |
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