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XPC860ENZP50D4 Технические параметры
Freescale Semiconductor, Inc. (NXP Semiconductors) XPC860ENZP50D4 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - Microprocessors | |
| Марка | ||
| Surface Mount | YES | |
| Number of Pins | 357Pins | |
| Number of Terminals | 357Terminals | |
| EU RoHS | Not Compliant | |
| ECCN (US) | 5A991 | |
| HTS | 8542.31.00.01 | |
| SVHC | Yes | |
| SVHC Exceeds Threshold | Yes | |
| Automotive | No | |
| PPAP | No | |
| Family Name | PowerQUICC MPC8xx Processor | |
| Instruction Set Architecture | RISC | |
| Number of CPU Cores | 1CPU Core | |
| Data Bus Width (bit) | 32 | |
| Instruction Cache Size | 4KB | |
| On-Chip Memory | 8KB/RAM | |
| Maximum Speed (MHz) | 50 | |
| Interface Type | I2C/SPI/UART | |
| UART | 1 | |
| USART | 0 | |
| Data Cache Size | 4KB | |
| Multiply Accumulate | No | |
| I2C | 1 | |
| I2S | 0 | |
| Minimum Operating Supply Voltage (V) | 2|3.135 | |
| Typical Operating Supply Voltage (V) | 2.5|3.3 | |
| Maximum Operating Supply Voltage (V) | 3.465|3.6 | |
| Maximum Power Dissipation (mW) | 735 | |
| Minimum Operating Temperature (°C) | 0 | |
| Maximum Operating Temperature (°C) | 95 | |
| Mounting | Surface Mount | |
| Package Height | 1.35(Max) | |
| Package Width | 25 | |
| Package Length | 25 | |
| PCB changed | 357 | |
| Standard Package Name | BGA | |
| Supplier Package | BGA | |
| Lead Shape | Ball | |
| RoHS | Non-Compliant | |
| Package Description | BGA, BGA357,19X19,50 | |
| Package Style | GRID ARRAY | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | BGA357,19X19,50 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Supply Voltage-Nom | 3.3 V | |
| Supply Voltage-Min | 3.135 V | |
| Manufacturer Part Number | XPC860ENZP50D4 | |
| Clock Frequency-Max | 50 MHz | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Manufacturer | Motorola Mobility LLC | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MOTOROLA INC | |
| Supply Voltage-Max | 3.465 V | |
| Risk Rank | 5.1 | |
| Part Package Code | BGA | |
| Part Status | Obsolete | |
| ECCN Code | 3A001.A.3 | |
| HTS Code | 8542.31.00.01 | |
| Subcategory | Other Microprocessor ICs | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Reach Compliance Code | unknown | |
| Frequency | 50 MHz | |
| Pin Count | 357 | |
| JESD-30 Code | S-PBGA-B357 | |
| Qualification Status | Not Qualified | |
| Power Supplies | 3.3 V | |
| Speed | 50 MHz | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC | |
| Bit Size | 32 | |
| Halogen Free | Not Halogen Free | |
| Seated Height-Max | 2.05 mm | |
| Address Bus Width | 32 | |
| Boundary Scan | YES | |
| Low Power Mode | YES | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| Ethernet | 0 | |
| USB | 0 | |
| SPI | 1 | |
| CAN | 0 | |
| Device Core | MPC8xx | |
| Width | 25 mm | |
| Length | 25 mm |
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