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XPC860PCZP66D4 Технические параметры

Freescale Semiconductor, Inc. (NXP Semiconductors)  XPC860PCZP66D4 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microprocessors
Марка
Surface Mount YES
Number of Terminals 357Terminals
EU RoHS Not Compliant
ECCN (US) 5A991
SVHC Yes
SVHC Exceeds Threshold Yes
Automotive No
PPAP No
Family Name PowerQUICC MPC8xx Processor
Instruction Set Architecture RISC
Number of CPU Cores 1CPU Core
Data Bus Width (bit) 32
Instruction Cache Size 16KB
On-Chip Memory 8KB/RAM
Maximum Speed (MHz) 66
Interface Type Ethernet/I2C/SPI/UART
UART 1
USART 0
Data Cache Size 8KB
Multiply Accumulate No
I2C 1
I2S 0
Ethernet Interface Type MII
Ethernet Speed 10Mbps/100Mbps
Minimum Operating Supply Voltage (V) 2|3.135
Typical Operating Supply Voltage (V) 2.5|3.3
Maximum Operating Supply Voltage (V) 3.465|3.6
Maximum Power Dissipation (mW) 762
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 95
Supplier Temperature Grade Extended
Mounting Surface Mount
Package Height 1.35(Max)
Package Width 25
Package Length 25
PCB changed 357
Standard Package Name BGA
Supplier Package BGA
Lead Shape Ball
Package Description BGA, BGA357,19X19,50
Package Style GRID ARRAY
Package Body Material PLASTIC/EPOXY
Package Equivalence Code BGA357,19X19,50
Свойство продукта Значение свойства
Operating Temperature-Min -40 °C
Supply Voltage-Nom 3.3 V
Reflow Temperature-Max (s) NOT SPECIFIED
Supply Voltage-Min 3.135 V
Manufacturer Part Number XPC860PCZP66D4
Clock Frequency-Max 66 MHz
Package Code BGA
Package Shape SQUARE
Manufacturer Motorola Mobility LLC
Part Life Cycle Code Transferred
Ihs Manufacturer MOTOROLA INC
Supply Voltage-Max 3.465 V
Risk Rank 5.17
Part Package Code BGA
Part Status Obsolete
ECCN Code 3A001.A.3
HTS Code 8542.31.00.01
Subcategory Other Microprocessor ICs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Pitch 1.27 mm
Reach Compliance Code unknown
Pin Count 357
JESD-30 Code S-PBGA-B357
Qualification Status Not Qualified
Power Supplies 3.3 V
Speed 66 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Seated Height-Max 2.05 mm
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Ethernet 1
USB 0
SPI 1
CAN 0
Device Core MPC8xx
Width 25 mm
Length 25 mm
Просмотр сходства
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