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- GS8161Z36DGD-200
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GS8161Z36DGD-200 Технические параметры
GSI Technology GS8161Z36DGD-200 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory | |
| Марка | ||
| Factory Lead Time | 10 Weeks | |
| Package / Case | BGA-165 | |
| Surface Mount | YES | |
| Number of Terminals | 165Terminals | |
| Maximum Clock Rate | 153.8@Flow-Through/200@Pipelined MHz | |
| Supplier Package | FBGA | |
| Typical Operating Supply Voltage | 2.5, 3.3 V | |
| Minimum Operating Supply Voltage | 2.3, 3 V | |
| Timing Type | Synchronous | |
| Number of I/O Lines | 36 BitI/O Line | |
| Maximum Operating Supply Voltage | 2.7, 3.6 V | |
| Moisture Sensitive | Yes | |
| Maximum Clock Frequency | 200 MHz | |
| Maximum Operating Temperature | + 70 C | |
| Supply Voltage-Max | 3.6 V | |
| Minimum Operating Temperature | 0 C | |
| Factory Pack QuantityFactory Pack Quantity | 36 | |
| Supply Voltage-Min | 2.3 V | |
| Mounting Styles | SMD/SMT | |
| Interface Type | Parallel | |
| Manufacturer | GSI Technology | |
| Brand | GSI Technology | |
| Tradename | NBT SRAM | |
| RoHS | Details | |
| Memory Types | SDR | |
| Package Description | LBGA, | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Number of Words Code | 512000Words Codes | |
| Package Body Material | PLASTIC/EPOXY | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Access Time-Max | 6.5 ns | |
| Operating Temperature-Max | 70 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | GS8161Z36DGD-200 | |
| Number of Words | 524288 wordsWord | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Part Life Cycle Code | Active |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Risk Rank | 4.78 | |
| Part Package Code | BGA | |
| Usage Level | Commercial grade | |
| Operating Temperature | 0 to 70 °C | |
| Series | GS8161Z36DGD | |
| Packaging | Tray | |
| ECCN Code | 3A991.B.2.B | |
| Type | NBT | |
| Additional Feature | FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | |
| HTS Code | 8542.32.00.41 | |
| Subcategory | Memory & Data Storage | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | compliant | |
| Pin Count | 165 | |
| JESD-30 Code | R-PBGA-B165 | |
| Supply Voltage-Max (Vsup) | 2.7 V | |
| Temperature Grade | COMMERCIAL | |
| Supply Voltage-Min (Vsup) | 2.3 V | |
| Memory Size | 18 Mbit | |
| Operating Mode | SYNCHRONOUS | |
| Supply Current-Max | 210 mA | |
| Access Time | 6.5@Flow-Through/3@P | |
| Organization | 512 k x 36 | |
| Seated Height-Max | 1.4 mm | |
| Memory Width | 36 | |
| Address Bus Width | 19 Bit | |
| Product Type | SRAM | |
| Memory Density | 18 | |
| Screening Level | Commercial | |
| Parallel/Serial | PARALLEL | |
| Memory IC Type | ZBT SRAM | |
| Product Category | SRAM | |
| Width | 13 mm | |
| Length | 15 mm |
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