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- GS82583ED18GK-500I
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GS82583ED18GK-500I Технические параметры
GSI Technology GS82583ED18GK-500I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory | |
| Марка | ||
| Package / Case | BGA-260 | |
| Surface Mount | YES | |
| Number of Terminals | 260Terminals | |
| RoHS | Details | |
| Maximum Clock Frequency | 500 MHz | |
| Interface Type | Parallel | |
| Supply Voltage-Min | 1.25 V | |
| Minimum Operating Temperature | - 40 C | |
| Maximum Operating Temperature | + 100 C | |
| Mounting Styles | SMD/SMT | |
| Memory Types | QDR-III | |
| Moisture Sensitive | Yes | |
| Factory Pack QuantityFactory Pack Quantity | 10 | |
| Tradename | SigmaQuad-IIIe | |
| Maximum Clock Rate | 500 MHz | |
| Supplier Package | FBGA | |
| Data Rate Architecture | DDR | |
| Typical Operating Supply Voltage | 1.3000 V | |
| Minimum Operating Supply Voltage | 1.25 V | |
| Timing Type | Synchronous | |
| Number of Words | 16 MWordsWord | |
| Number of I/O Lines | 18 BitI/O Line | |
| Maximum Operating Supply Voltage | 1.35 V | |
| Mounting | Surface Mount | |
| Supply Voltage-Max | 1.35 V | |
| Package Description | HBGA, | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Number of Words Code | 16000000Words Codes | |
| Package Body Material | PLASTIC/EPOXY | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Rohs Code | Yes | |
| Manufacturer Part Number | GS82583ED18GK-500I | |
| Supply Voltage-Nom (Vsup) | 1.2 V | |
| Package Code | HBGA | |
| Package Shape | RECTANGULAR | |
| Part Life Cycle Code | Active |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Risk Rank | 5.74 | |
| Usage Level | Industrial grade | |
| Packaging | Tray | |
| Series | GS82583ED18GK | |
| Operating Temperature | -40 to 100 °C | |
| JESD-609 Code | e1 | |
| ECCN Code | 3A991.B.2.B | |
| Type | SigmaQuad-IIIe B4 | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| HTS Code | 8542.32.00.41 | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | compliant | |
| Pin Count | 260 | |
| JESD-30 Code | R-PBGA-B260 | |
| Supply Voltage-Max (Vsup) | 1.25 V | |
| Supply Voltage-Min (Vsup) | 1.15 V | |
| Memory Size | 288 Mbit | |
| Number of Ports | 1Port | |
| Operating Mode | SYNCHRONOUS | |
| Supply Current-Max | 1.2 A | |
| Organization | 16 M x 18 | |
| Seated Height-Max | 2.3 mm | |
| Memory Width | 18 | |
| Address Bus Width | 22 Bit | |
| Density | 288 Mbit | |
| Memory Density | 301989888 bit | |
| Screening Level | Industrial | |
| Parallel/Serial | PARALLEL | |
| Memory IC Type | QDR SRAM | |
| Width | 14 mm | |
| Length | 22 mm |
Индекс :
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