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- GS8673ED36BK-675I
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GS8673ED36BK-675I Технические параметры
GSI Technology GS8673ED36BK-675I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory | |
| Марка | ||
| Factory Lead Time | 12 Weeks | |
| Package / Case | BGA-260 | |
| Surface Mount | YES | |
| Number of Terminals | 260Terminals | |
| Maximum Clock Rate | 675/450 MHz | |
| Supplier Package | BGA | |
| Data Rate Architecture | QDR | |
| Typical Operating Supply Voltage | 1.3500 V | |
| Minimum Operating Supply Voltage | 1.3 V | |
| Timing Type | Synchronous | |
| Number of Words | 2 MWordsWord | |
| Number of I/O Lines | 36 BitI/O Line | |
| Maximum Operating Supply Voltage | 1.4 V | |
| Mounting | Surface Mount | |
| Moisture Sensitive | Yes | |
| Maximum Clock Frequency | 675 MHz | |
| Maximum Operating Temperature | + 100 C | |
| Supply Voltage-Max | 1.4 V | |
| Minimum Operating Temperature | - 40 C | |
| Factory Pack QuantityFactory Pack Quantity | 8 | |
| Supply Voltage-Min | 1.3 V | |
| Mounting Styles | SMD/SMT | |
| Interface Type | Parallel | |
| Manufacturer | GSI Technology | |
| Brand | GSI Technology | |
| Tradename | SigmaQuad-IIIe | |
| Memory Types | DDR | |
| Package Description | HBGA, | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Number of Words Code | 2000000Words Codes | |
| Package Body Material | PLASTIC/EPOXY | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Rohs Code | No | |
| Manufacturer Part Number | GS8673ED36BK-675I | |
| Supply Voltage-Nom (Vsup) | 1.35 V | |
| Package Code | HBGA | |
| Package Shape | RECTANGULAR |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Risk Rank | 5.81 | |
| Usage Level | Industrial grade | |
| Operating Temperature | -40 to 85 °C | |
| Series | GS8673ED36BK | |
| Packaging | Tray | |
| ECCN Code | 3A991.B.2.B | |
| Type | SigmaQuad-IIIe B4 | |
| HTS Code | 8542.32.00.41 | |
| Subcategory | Memory & Data Storage | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | compliant | |
| Pin Count | 260 | |
| JESD-30 Code | R-PBGA-B260 | |
| Supply Voltage-Max (Vsup) | 1.4 V | |
| Supply Voltage-Min (Vsup) | 1.3 V | |
| Memory Size | 72 Mbit | |
| Operating Mode | SYNCHRONOUS | |
| Supply Current-Max | 3.17 A | |
| Architecture | Pipelined | |
| Organization | 2 M x 36 | |
| Seated Height-Max | 2.3 mm | |
| Memory Width | 36 | |
| Address Bus Width | 19 Bit | |
| Product Type | SRAM | |
| Density | 72 Mbit | |
| Memory Density | 75497472 bit | |
| Screening Level | Industrial | |
| Parallel/Serial | PARALLEL | |
| Memory IC Type | DDR SRAM | |
| Product Category | SRAM | |
| Width | 14 mm | |
| Length | 22 mm |
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