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- TM11AP1-88P(03)
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TM11AP1-88P(03) Технические параметры
Hirose Electric Co Ltd TM11AP1-88P(03) technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Modular Connectors - Plugs | |
| Марка | ||
| Factory Lead Time | 10 Weeks | |
| Mount | Cable | |
| Housing Material | Polycarbonate (PC) | |
| Cable Types | Round Cable, Not Specified | |
| Contact Materials | Phosphor Bronze | |
| Packaging | Bulk | |
| Series | TM11P | |
| Published | 2002 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | IDC | |
| ECCN Code | EAR99 | |
| Connector Type | Plug | |
| Max Operating Temperature | 60°C | |
| Min Operating Temperature | -25°C | |
| Color | Translucent - Clear | |
| Number of Rows | 1Row | |
| Gender | Male | |
| MIL Conformance | NO | |
| DIN Conformance | NO | |
| IEC Conformance | NO |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Filter Feature | NO | |
| Mixed Contacts | NO | |
| Option | GENERAL PURPOSE | |
| Orientation | Straight | |
| Shielding | Shielded | |
| Current Rating | 500mA | |
| Contact Finish | Gold | |
| Voltage - Rated AC | 125V | |
| Reliability | COMMERCIAL | |
| Number of Contacts | 8Contacts | |
| Empty Shell | NO | |
| Rated Current (Signal) | 0.5A | |
| Contact Style | TELCOM, MODULAR | |
| Wire Gauge | 26 AWG | |
| Insulation Resistance | 100MOhm | |
| Dielectric Withstanding Voltage | 700VAC V | |
| Wire/Cable Type | Round | |
| Number of Ports | 1Port | |
| Wire/Cable Gauge | 26 AWG | |
| Number of Positions/Contacts | 8p8c (RJ45, Ethernet)Positions/Contact | |
| Features | Strain Relief | |
| Length | 1.189 30.20mm | |
| REACH SVHC | No SVHC | |
| Radiation Hardening | No | |
| RoHS Status | RoHS Compliant |
TM11AP1-88P(03) Документы
- DatasheetsTM11P/AP Series
- Mfg CAD ModelsTM11AP1-88P(03).igs TM11AP1-88P(03).stp
- PCN Design/SpecificationMult devs Material manufacturer chg 23/AUG/2018
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