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MB89193APF-G-261-BND-RE1 Технические параметры

Infineon  MB89193APF-G-261-BND-RE1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microcontrollers
Марка Infineon
Package / Case Wide 2010 (5025 Metric), 1020
Mounting Type Surface Mount
Supplier Device Package 1020
Package Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;
Mfr TE Connectivity Passive Product
Product Status Active
Number of I/Os 16I/Os
Base Product Number MB89193
Data Converters A/D 8x8b
Operating Temperature -55°C ~ 155°C
Series 3430
Size / Dimension 0.096 L x 0.197 W (2.45mm x 5.00mm)
Tolerance ±1%
Number of Terminations 2Terminations
Temperature Coefficient ±100ppm/°C
Resistance 91 kOhms
Свойство продукта Значение свойства
Composition Thick Film
Power (Watts) 2W
Failure Rate -
Oscillator Type External
Speed 4.2MHz
RAM Size 256 x 8
Voltage - Supply (Vcc/Vdd) 2.2V ~ 6V
Core Processor F²MC-8L
Peripherals POR, WDT
Program Memory Type Mask ROM
Core Size 8-Bit
Program Memory Size 8KB (8K x 8)
Connectivity Serial I/O
EEPROM Size -
Features Automotive AEC-Q200
Height Seated (Max) 0.030 (0.75mm)
Ratings AEC-Q200
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