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BGA9C1MN9E6327XTSA1 Технические параметры

Infineon Technologies  BGA9C1MN9E6327XTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация RF Amplifiers
Марка
Package / Case 9-XFLGA
Mounting Type Surface Mount
Supplier Device Package PG-TSNP-9-6
Base Product Number BGA9
Product Status Active
Mfr Infineon Technologies
Package Type TSNP-9-6
Number of Channels per Chip 1
Maximum Operating Frequency 5000 MHz
MSL MSL 1 - Unlimited
Maximum Operating Temperature + 85 C
Minimum Operating Temperature - 30 C
Factory Pack QuantityFactory Pack Quantity 12000
Mounting Styles SMD/SMT
NF - Noise Figure 1 dB
P1dB - Compression Point - 19 dBm
Part # Aliases BGA 9C1MN9 E6327 SP002367712
Manufacturer Infineon
Brand Infineon Technologies
Свойство продукта Значение свойства
OIP3 - Third Order Intercept - 7 dBm
Series -
Packaging Cut Tape
Type Low Noise Amplifiers
Subcategory Wireless & RF Integrated Circuits
Technology SiGe
Voltage - Supply 1.1V ~ 2V
Frequency 4.4GHz ~ 5GHz
Pin Count 9
Operating Frequency 4.4 GHz to 5 GHz
Operating Supply Voltage 1.1 V to 2 V
Test Frequency 4.9GHz
Operating Supply Current 5.6 mA
Current - Supply 5.6mA
Amplifier Type Low Noise
Product Type RF Amplifier
Gain 20.5dB
RF Type 5G
Noise Figure 1dB
P1dB 8dBm
Product Category RF Amplifier

BGA9C1MN9E6327XTSA1 Документы

  • Datasheets
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