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BGA9H1BN6E6327XTSA1 Технические параметры

Infineon Technologies  BGA9H1BN6E6327XTSA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация RF Amplifiers
Марка
Mounting Type Surface Mount
Package / Case 6-XFDFN
Supplier Device Package PG-TSNP-6-10
Mfr Infineon Technologies
Package Tape & Reel (TR)
Product Status Active
Base Product Number BGA9
Maximum Operating Temperature + 85 C
Minimum Operating Temperature - 40 C
Factory Pack QuantityFactory Pack Quantity 12000
Mounting Styles SMD/SMT
NF - Noise Figure 0.6 dB
P1dB - Compression Point - 17 dBm
Part # Aliases BGA 9H1BN6 E6327 SP002367716
Manufacturer Infineon
Brand Infineon Technologies
OIP3 - Third Order Intercept - 7 dBm
Свойство продукта Значение свойства
RoHS Details
Series -
Packaging MouseReel
Type General Purpose Amplifiers
Subcategory Wireless & RF Integrated Circuits
Technology Si
Voltage - Supply 1.1V ~ 3.3V
Frequency 2.3GHz ~ 2.7GHz
Operating Frequency 2.3 GHz to 2.7 GHz
Operating Supply Voltage 1.1 V to 3.3 V
Test Frequency 2.6GHz
Operating Supply Current 2.2 mA
Current - Supply 5.5mA
Product Type RF Amplifier
Gain 21.8dB
RF Type 4G, 5G
Noise Figure 1.1dB
P1dB 5dBm
Product Category RF Amplifier

BGA9H1BN6E6327XTSA1 Документы

  • Datasheets
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