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XE167F72F66LACFXQMA1 Технические параметры

Infineon Technologies  XE167F72F66LACFXQMA1 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microcontrollers
Марка
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 144-LQFP Exposed Pad
Number of Pins 144Pins
Data Converters A/D 24x10b
Number of I/Os 118I/Os
ROM(word) 589824
Operating Temperature -40°C~85°C TA
Packaging Tray
Series XE16x
Published 2008
Pbfree Code yes
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 144Terminations
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Max Power Dissipation 1W
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Pitch 0.5mm
Frequency 66MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number SA*XE167F
Свойство продукта Значение свойства
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 1.6V
Interface CAN, EBI/EMI, I2C, LIN, SPI, UART, USART
Memory Size 576kB
Oscillator Type Internal
RAM Size 50K x 8
Voltage - Supply (Vcc/Vdd) 3V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Core Processor C166SV2
Peripherals I2S, POR, PWM, WDT
Program Memory Type FLASH
Core Size 16-Bit
Program Memory Size 576KB 576K x 8
Connectivity CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Bit Size 16
Has ADC YES
DMA Channels NO
Data Bus Width 16b
PWM Channels YES
DAC Channels NO
Number of Timers/Counters 11Timers/Counters
Address Bus Width 24
On Chip Program ROM Width 8
Length 20mm
Height Seated (Max) 1.6mm
RoHS Status ROHS3 Compliant
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XE167F72F66LACFXQMA1 Документы

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