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89TTM552BL Технические параметры
Integrated Device Technology (IDT) 89TTM552BL technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Interface - Specialized | |
| Марка | ||
| Surface Mount | YES | |
| Number of Terminals | 960Terminals | |
| Manufacturer Part Number | 89TTM552BL | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | BGA | |
| Package Description | 35 X 35 MM, 1 MM PITCH, FPBGA-960 | |
| Risk Rank | 5.66 | |
| Operating Temperature-Max | 85 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Nom | 1.8 V |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Reflow Temperature-Max (s) | 30 | |
| Supply Voltage-Min | 1.71 V | |
| JESD-609 Code | e0 | |
| ECCN Code | 5A991 | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 225 | |
| Reach Compliance Code | not_compliant | |
| Pin Count | 960 | |
| JESD-30 Code | S-PBGA-B960 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | OTHER | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT | |
| Seated Height-Max | 3.29 mm | |
| Length | 35 mm | |
| Width | 35 mm |
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