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AGFA006R24C2I3E Технические параметры

Intel  AGFA006R24C2I3E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка Intel
Package / Case Axial
Supplier Device Package Axial
Package Bulk
Mfr Stackpole Electronics Inc
Product Status Active
Number of I/Os 576I/Os
Operating Temperature -55°C ~ 235°C
Series RSF
Size / Dimension 0.177 Dia x 0.433 L (4.50mm x 11.00mm)
Tolerance ±5%
Number of Terminations 2Terminations
Temperature Coefficient ±200ppm/°C
Свойство продукта Значение свойства
Resistance 390 Ohms
Composition Metal Oxide Film
Power (Watts) 1W
Failure Rate -
Speed 1.4GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MPU, FPGA
Primary Attributes FPGA - 573K Logic Elements
Flash Size -
Features Flame Retardant Coating, Safety
Height Seated (Max) -
Просмотр сходства
AGFA006R24C2I3E brand manufacturers: Intel, Anli stock, AGFA006R24C2I3E reference price.Intel. AGFA006R24C2I3E parameters, AGFA006R24C2I3E Datasheet PDF and pin diagram description download.You can use the AGFA006R24C2I3E Embedded - System On Chip (SoC), DSP Datesheet PDF, find AGFA006R24C2I3E pin diagram and circuit diagram and usage method of function,AGFA006R24C2I3E electronics tutorials.You can download from the Anli.