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AGFA022R31C2E3E Технические параметры

Intel  AGFA022R31C2E3E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка Intel
Contact Plating -
Package / Case -
Supplier Device Package -
Factory Pack QuantityFactory Pack Quantity 10000
Part # Aliases 7158-3721-90
Manufacturer Yazaki
Brand Yazaki
RoHS Details
Number of I/Os 720I/Os
Package Tray
Mfr Intel
Product Status Active
Operating Temperature 0°C ~ 100°C (TJ)
Свойство продукта Значение свойства
Series Agilex F
Gender -
Subcategory Automotive Connectors
Speed 1.4GHz
RAM Size 256KB
Accessory Type Wire Seal
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MPU, FPGA
Product Type Automotive Connectors
Primary Attributes FPGA - 2.2M Logic Elements
Flash Size -
Product Accessories
Product Category Automotive Connectors
Просмотр сходства
AGFA022R31C2E3E brand manufacturers: Intel, Anli stock, AGFA022R31C2E3E reference price.Intel. AGFA022R31C2E3E parameters, AGFA022R31C2E3E Datasheet PDF and pin diagram description download.You can use the AGFA022R31C2E3E Embedded - System On Chip (SoC), DSP Datesheet PDF, find AGFA022R31C2E3E pin diagram and circuit diagram and usage method of function,AGFA022R31C2E3E electronics tutorials.You can download from the Anli.