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AGFA023R24C3E3V Технические параметры

Intel  AGFA023R24C3E3V technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка Intel
Package / Case 2340-BFBGA Exposed Pad
Supplier Device Package 2340-BGA (45x42)
Number of I/Os 480I/Os
Series Agilex F
Packaging Tray
Operating Temperature 0°C ~ 100°C (TJ)
Свойство продукта Значение свойства
Part Status Active
Speed 1.4GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MPU, FPGA
Primary Attributes FPGA - 2.3M Logic Elements
Просмотр сходства
AGFA023R24C3E3V brand manufacturers: Intel, Anli stock, AGFA023R24C3E3V reference price.Intel. AGFA023R24C3E3V parameters, AGFA023R24C3E3V Datasheet PDF and pin diagram description download.You can use the AGFA023R24C3E3V Embedded - System On Chip (SoC), DSP Datesheet PDF, find AGFA023R24C3E3V pin diagram and circuit diagram and usage method of function,AGFA023R24C3E3V electronics tutorials.You can download from the Anli.