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AGFA027R31C3E3E Технические параметры

Intel  AGFA027R31C3E3E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка Intel
Package / Case 1206 (3216 Metric)
Supplier Device Package 1206
Package Tape & Reel (TR)
Base Product Number RN732B
Mfr KOA Speer Electronics, Inc.
Product Status Obsolete
Number of I/Os 720I/Os
Operating Temperature -55°C ~ 155°C
Series RN73
Size / Dimension 0.126 L x 0.063 W (3.20mm x 1.60mm)
Tolerance ±1%
Number of Terminations 2Terminations
Свойство продукта Значение свойства
Temperature Coefficient ±50ppm/°C
Resistance 111 Ohms
Composition Thin Film
Power (Watts) 0.125W, 1/8W
Speed 1.4GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MPU, FPGA
Primary Attributes FPGA - 2.7M Logic Elements
Flash Size -
Features Moisture Resistant
Height Seated (Max) 0.028 (0.70mm)
Просмотр сходства
AGFA027R31C3E3E brand manufacturers: Intel, Anli stock, AGFA027R31C3E3E reference price.Intel. AGFA027R31C3E3E parameters, AGFA027R31C3E3E Datasheet PDF and pin diagram description download.You can use the AGFA027R31C3E3E Embedded - System On Chip (SoC), DSP Datesheet PDF, find AGFA027R31C3E3E pin diagram and circuit diagram and usage method of function,AGFA027R31C3E3E electronics tutorials.You can download from the Anli.