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AGFB006R16A2E3V Технические параметры

Intel  AGFB006R16A2E3V technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка Intel
Contact Plating Gold
Package / Case -
Supplier Device Package -
Housing Material Thermoplastic polyester
Brand Amphenol Commercial Products
Manufacturer Amphenol
Contact Materials Phosphor Bronze
Number of Positions / Contacts per Port 8P8C
Factory Pack QuantityFactory Pack Quantity 450
Minimum Operating Temperature 0 C
Maximum Operating Temperature + 70 C
Number of I/Os 384I/Os
Package Tray
Mfr Intel
Product Status Active
Packaging Tray
Operating Temperature 0°C ~ 100°C (TJ)
Series Agilex F
Type Magnetic Jack
Color Black
Свойство продукта Значение свойства
Gender Jack (Female)
Subcategory Modular Connectors / Ethernet Connectors
Shielding Shielded
Termination Style Solder Pin
Configuration 1x1
Number of Ports 1 PortPort
Speed 1.4GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MPU, FPGA
Product Type Modular Connectors / Ethernet Connectors
Operating Temperature Range 0 C to + 70 C
Primary Attributes FPGA - 573K Logic Elements
Flash Size -
Product Connectors
Mounting Angle Right Angle
USOC Codes RJ45
Product Category Modular Connectors / Ethernet Connectors
Flammability Rating UL 94V-0
Просмотр сходства
AGFB006R16A2E3V brand manufacturers: Intel, Anli stock, AGFB006R16A2E3V reference price.Intel. AGFB006R16A2E3V parameters, AGFB006R16A2E3V Datasheet PDF and pin diagram description download.You can use the AGFB006R16A2E3V Embedded - System On Chip (SoC), DSP Datesheet PDF, find AGFB006R16A2E3V pin diagram and circuit diagram and usage method of function,AGFB006R16A2E3V electronics tutorials.You can download from the Anli.