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- AGFB006R24C3E3V
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AGFB006R24C3E3V Технические параметры
Intel AGFB006R24C3E3V technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - System On Chip (SoC) | |
| Марка | Intel | |
| Contact Plating | Gold | |
| Mount | Bulkhead, Front Side Nut, Jam Nut, Panel | |
| Package / Case | - | |
| Supplier Device Package | - | |
| RoHS | Compliant | |
| Number of I/Os | 576I/Os | |
| Package | Tray | |
| Mfr | Intel | |
| Product Status | Active | |
| Packaging | Bulk | |
| Operating Temperature | 0°C ~ 100°C (TJ) | |
| Series | Agilex F | |
| Termination | Crimp | |
| Connector Type | Crimp, Receptacle | |
| Number of Positions | 66Positions | |
| Max Operating Temperature | 175 °C |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Min Operating Temperature | -65 °C | |
| Gender | Female | |
| Fastening Type | Threaded | |
| Orientation | Straight | |
| Depth | 46.02 mm | |
| Number of Contacts | 66Contacts | |
| Plating | Cadmium | |
| Speed | 1.4GHz | |
| RAM Size | 256KB | |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | |
| Peripherals | DMA, WDT | |
| Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Architecture | MPU, FPGA | |
| Primary Attributes | FPGA - 573K Logic Elements | |
| Flash Size | - | |
| Length | 31.57 mm | |
| Radiation Hardening | No | |
| Ratings | Environment Resistant |
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