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AGFB008R16A3E3E Технические параметры

Intel  AGFB008R16A3E3E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка Intel
Package / Case -
Supplier Device Package -
Material Nickel Plated Brass
Maximum Cable Diameter (mm) 11.94 mm
Minimum Cable Diameter (mm) 4.06 mm
Angle Straight
Manufacturer Part Number 291378
Approvals CSA, UL
Cable Style Round
Manufacturer Pepperl Fuchs
Grip Type Bushing Grip
Number of I/Os 384I/Os
Package Tray
Свойство продукта Значение свойства
Mfr Intel
Product Status Active
Operating Temperature 0°C ~ 100°C (TJ)
Series Agilex F
Composition Metallic
Speed 1.4GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MPU, FPGA
Primary Attributes FPGA - 764K Logic Elements
Flash Size -
IP Rating IP66, IP68
Просмотр сходства
AGFB008R16A3E3E brand manufacturers: Intel, Anli stock, AGFB008R16A3E3E reference price.Intel. AGFB008R16A3E3E parameters, AGFB008R16A3E3E Datasheet PDF and pin diagram description download.You can use the AGFB008R16A3E3E Embedded - System On Chip (SoC), DSP Datesheet PDF, find AGFB008R16A3E3E pin diagram and circuit diagram and usage method of function,AGFB008R16A3E3E electronics tutorials.You can download from the Anli.