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AGFB012R24B2E3V Технические параметры

Intel  AGFB012R24B2E3V technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка Intel
Mounting Type Panel Mount, Through Hole
Package / Case -
Mounting Feature -
Shell Material Stainless Steel
Supplier Device Package -
Insert Material Fluorosilicone Elastomer
Backshell Material, Plating -
Voltage, Rating 600VAC, 850VDC
Package Bulk
Primary Material Metal
Base Product Number D38999/25HE
Mfr TE Connectivity Deutsch Connectors
Product Status Active
Contact Materials Nickel Iron Alloy
Contact Finish Mating Gold
Number of I/Os 768I/Os
Operating Temperature -65°C ~ 200°C
Series MIL-DTL-38999 Series III, DTS
Termination Solder
Connector Type Receptacle, Female Sockets
Number of Positions 23Positions
Свойство продукта Значение свойства
Color Silver
Applications Aviation, Communication Systems, Industrial
Fastening Type Threaded
Current Rating (Amps) -
Orientation D
Shielding Shielded
Ingress Protection Environment Resistant
Shell Finish Electroless Nickel
Shell Size - Insert 17-99
Speed 1.4GHz
RAM Size 256KB
Shell Size, MIL -
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Cable Opening -
Architecture MPU, FPGA
Primary Attributes FPGA - 1.2M Logic Elements
Flash Size -
Features Hermetically Sealed
Contact Finish Thickness - Mating -
Material Flammability Rating -
Просмотр сходства
AGFB012R24B2E3V brand manufacturers: Intel, Anli stock, AGFB012R24B2E3V reference price.Intel. AGFB012R24B2E3V parameters, AGFB012R24B2E3V Datasheet PDF and pin diagram description download.You can use the AGFB012R24B2E3V Embedded - System On Chip (SoC), DSP Datesheet PDF, find AGFB012R24B2E3V pin diagram and circuit diagram and usage method of function,AGFB012R24B2E3V electronics tutorials.You can download from the Anli.