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AGFB014R24D1E3V Технические параметры

Intel  AGFB014R24D1E3V technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка Intel
Package / Case 2340-BFBGA Exposed Pad
Supplier Device Package 2340-BGA (45x42)
Series Agilex F
Packaging Tray
Operating Temperature 0°C ~ 100°C (TJ)
Part Status Active
Свойство продукта Значение свойства
Speed 1.4GHz
RAM Size 256KB
Core Processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MPU, FPGA
Primary Attributes FPGA - 1.4M Logic Elements
Просмотр сходства
AGFB014R24D1E3V brand manufacturers: Intel, Anli stock, AGFB014R24D1E3V reference price.Intel. AGFB014R24D1E3V parameters, AGFB014R24D1E3V Datasheet PDF and pin diagram description download.You can use the AGFB014R24D1E3V Embedded - System On Chip (SoC), DSP Datesheet PDF, find AGFB014R24D1E3V pin diagram and circuit diagram and usage method of function,AGFB014R24D1E3V electronics tutorials.You can download from the Anli.