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AGFB023R25A3E4X Технические параметры

Intel  AGFB023R25A3E4X technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка Intel
Package / Case 0805 (2012 Metric)
Supplier Device Package 0805
Package Tape & Reel (TR)
Base Product Number RN732A
Mfr KOA Speer Electronics, Inc.
Product Status Obsolete
Number of I/Os 480I/Os
Operating Temperature -55°C ~ 155°C
Series RN73
Size / Dimension 0.079 L x 0.049 W (2.00mm x 1.25mm)
Tolerance ±1%
Number of Terminations 2Terminations
Свойство продукта Значение свойства
Temperature Coefficient ±50ppm/°C
Resistance 505 Ohms
Composition Thin Film
Power (Watts) 0.1W, 1/10W
Speed 1.4GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MPU, FPGA
Primary Attributes FPGA - 2.3M Logic Elements
Flash Size -
Features Moisture Resistant
Height Seated (Max) 0.024 (0.60mm)
Просмотр сходства
AGFB023R25A3E4X brand manufacturers: Intel, Anli stock, AGFB023R25A3E4X reference price.Intel. AGFB023R25A3E4X parameters, AGFB023R25A3E4X Datasheet PDF and pin diagram description download.You can use the AGFB023R25A3E4X Embedded - System On Chip (SoC), DSP Datesheet PDF, find AGFB023R25A3E4X pin diagram and circuit diagram and usage method of function,AGFB023R25A3E4X electronics tutorials.You can download from the Anli.