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AGFB023R31C2I3E Технические параметры

Intel  AGFB023R31C2I3E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка Intel
Package / Case 3184-BFBGA Exposed Pad
Supplier Device Package 3184-BGA (56x45)
Number of I/Os 480I/Os
Series Agilex F
Packaging Tray
Operating Temperature -40°C ~ 100°C (TJ)
Свойство продукта Значение свойства
Part Status Active
Speed 1.4GHz
RAM Size 256KB
Core Processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MPU, FPGA
Primary Attributes FPGA - 2.3M Logic Elements
Просмотр сходства
AGFB023R31C2I3E brand manufacturers: Intel, Anli stock, AGFB023R31C2I3E reference price.Intel. AGFB023R31C2I3E parameters, AGFB023R31C2I3E Datasheet PDF and pin diagram description download.You can use the AGFB023R31C2I3E Embedded - System On Chip (SoC), DSP Datesheet PDF, find AGFB023R31C2I3E pin diagram and circuit diagram and usage method of function,AGFB023R31C2I3E electronics tutorials.You can download from the Anli.