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- AGFC019R25A2I3E
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AGFC019R25A2I3E Технические параметры
Intel AGFC019R25A2I3E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - System On Chip (SoC) | |
| Марка | Intel | |
| Package / Case | 0402 (1005 Metric) | |
| Supplier Device Package | 0402 | |
| Package | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | |
| Base Product Number | RN73H1E | |
| Mfr | KOA Speer Electronics, Inc. | |
| Product Status | Active | |
| Number of I/Os | 480I/Os | |
| Operating Temperature | -55°C ~ 155°C | |
| Series | RN73H | |
| Size / Dimension | 0.039 L x 0.020 W (1.00mm x 0.50mm) | |
| Tolerance | ±0.5% | |
| Number of Terminations | 2Terminations | |
| Temperature Coefficient | ±50ppm/°C |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Resistance | 10.1 Ohms | |
| Composition | Metal Film | |
| Power (Watts) | 0.063W, 1/16W | |
| Failure Rate | - | |
| Speed | 1.4GHz | |
| RAM Size | 256KB | |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | |
| Peripherals | DMA, WDT | |
| Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Architecture | MPU, FPGA | |
| Primary Attributes | FPGA - 1.9M Logic Elements | |
| Flash Size | - | |
| Features | Automotive AEC-Q200, Moisture Resistant | |
| Height Seated (Max) | 0.016 (0.40mm) | |
| Ratings | AEC-Q200 |
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