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AGFC023R25A2I3E Технические параметры

Intel  AGFC023R25A2I3E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка Intel
Package / Case -
Supplier Device Package -
Manufacturer Part Number NZM4-XHB-DA-NA
Manufacturer Klockner-Moeller, Div of Eaton
Number of I/Os 480I/Os
Package Tray
Mfr Intel
Product Status Active
Свойство продукта Значение свойства
Operating Temperature -40°C ~ 100°C (TJ)
Series Agilex F
Speed 1.4GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MPU, FPGA
Primary Attributes FPGA - 2.3M Logic Elements
Flash Size -
Просмотр сходства
AGFC023R25A2I3E brand manufacturers: Intel, Anli stock, AGFC023R25A2I3E reference price.Intel. AGFC023R25A2I3E parameters, AGFC023R25A2I3E Datasheet PDF and pin diagram description download.You can use the AGFC023R25A2I3E Embedded - System On Chip (SoC), DSP Datesheet PDF, find AGFC023R25A2I3E pin diagram and circuit diagram and usage method of function,AGFC023R25A2I3E electronics tutorials.You can download from the Anli.