ANLI Electronic parts stores,electronic components,electronic parts,electronics parts supply

FXXWK1UHSF Технические параметры

Intel  FXXWK1UHSF technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Thermal - Heat Sinks
Марка Intel
Mounting Type Panel Mount, Through Hole
Mounting Feature Bulkhead
Shell Material Aluminum Alloy
Voltage, Rating 500VAC
Package Bulk
Primary Material Metal
Base Product Number MKJ3C
Mfr ITT Cannon, LLC
Product Status Active
Contact Finish Mating Gold
Factory Pack QuantityFactory Pack Quantity 1
Part # Aliases 999MVL
Manufacturer Intel
Brand Intel
RoHS Details
Operating Temperature -55°C ~ 150°C
Series MKJ3
Свойство продукта Значение свойства
Termination Solder
Connector Type Receptacle, Female Sockets
Number of Positions 26Positions
Color Olive Drab
Fastening Type Bayonet Lock
Subcategory Heatsinks
Current Rating (Amps) 5A
Orientation N (Normal)
Shielding Shielded
Ingress Protection -
Shell Finish Olive Drab Cadmium
Shell Size - Insert 10-26
Shell Size, MIL -
Product Type Heatsinks
Product Heatsinks
Features -
Product Category Heat Sinks
Contact Finish Thickness - Mating 50.0µin (1.27µm)
FXXWK1UHSF brand manufacturers: Intel, Anli stock, FXXWK1UHSF reference price.Intel. FXXWK1UHSF parameters, FXXWK1UHSF Datasheet PDF and pin diagram description download.You can use the FXXWK1UHSF Thermal - Heat Sinks, DSP Datesheet PDF, find FXXWK1UHSF pin diagram and circuit diagram and usage method of function,FXXWK1UHSF electronics tutorials.You can download from the Anli.