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GE28F160C3TD70 Технические параметры

Intel  GE28F160C3TD70 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка Intel
Surface Mount YES
Number of Terminals 46Terminals
Package Description VFBGA-46
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Moisture Sensitivity Levels NOT SPECIFIED
Number of Words Code 1000000Words Codes
Package Body Material PLASTIC/EPOXY
Operating Temperature-Min -40 °C
Reflow Temperature-Max (s) 30
Access Time-Max 70 ns
Operating Temperature-Max 85 °C
Rohs Code No
Manufacturer Part Number GE28F160C3TD70
Number of Words 1048576 wordsWord
Supply Voltage-Nom (Vsup) 3 V
Package Code VFBGA
Package Shape RECTANGULAR
Manufacturer Rochester Electronics LLC
Part Life Cycle Code Active
Ihs Manufacturer ROCHESTER ELECTRONICS LLC
Risk Rank 5.83
Part Package Code BGA
JESD-609 Code e0
Свойство продукта Значение свойства
Pbfree Code No
Terminal Finish TIN LEAD
Additional Feature USER-SELECTABLE 3V OR 12V VPP; TOP BOOT BLOCK
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 240
Number of Functions 1Function
Terminal Pitch 0.75 mm
Reach Compliance Code unknown
Pin Count 46
JESD-30 Code R-PBGA-B46
Qualification Status COMMERCIAL
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.7 V
Operating Mode ASYNCHRONOUS
Organization 1MX16
Seated Height-Max 1 mm
Memory Width 16
Memory Density 16777216 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Programming Voltage 3 V
Width 6.964 mm
Length 7.286 mm
Просмотр сходства
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