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TE28F128P30T85 Технические параметры

Intel Corporation  TE28F128P30T85 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory - Modules
Марка
Surface Mount YES
Number of Terminals 56Terminals
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer INTEL CORP
Part Package Code TSOP
Package Description TSSOP, TSSOP56,.8,20
Access Time-Max 85 ns
Number of Words 8388608 wordsWord
Number of Words Code 8000000Words Codes
Supply Voltage-Nom (Vsup) 1.8 V
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Package Shape RECTANGULAR
Package Equivalence Code TSSOP56,.8,20
Package Code TSSOP
Package Body Material PLASTIC/EPOXY
Operating Temperature-Min -40 °C
Operating Temperature-Max 85 °C
JESD-609 Code e0
ECCN Code EAR99
Type NOR TYPE
Terminal Finish TIN LEAD
Additional Feature SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
HTS Code 8542.32.00.51
Terminal Position DUAL
Terminal Form GULL WING
Number of Functions 1Function
Свойство продукта Значение свойства
Terminal Pitch 0.5 mm
Reach Compliance Code compliant
Pin Count 56
JESD-30 Code R-PDSO-G56
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 1.7 V
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.051 mA
Organization 8MX16
Seated Height-Max 1.2 mm
Memory Width 16
Standby Current-Max 0.000005 A
Memory Density 134217728 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Programming Voltage 1.8 V
Data Polling NO
Toggle Bit NO
Command User Interface YES
Number of Sectors/Size 4,127
Sector Size 16K,64K
Page Size 4 words
Boot Block TOP
Common Flash Interface YES
Length 18.4 mm
Width 14 mm

TE28F128P30T85 Документы

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