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- FI-TD44SB-VF85-R750
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FI-TD44SB-VF85-R750 Технические параметры
JAE Electronics FI-TD44SB-VF85-R750 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Rectangular Connectors - Headers, Receptacles, Female Sockets | |
| Марка | ||
| Mounting Type | Surface Mount | |
| Contact Finish Mating | Gold | |
| Contact Materials | Copper Alloy | |
| Insulation Materials | Thermoplastic | |
| Operating Temperature | -40°C~85°C | |
| Packaging | Tape & Reel (TR) | |
| Series | FI-D | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Solder | |
| Connector Type | Receptacle | |
| Number of Positions | 44Positions |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Number of Rows | 1Row | |
| Contact Type | Center Strip Contact | |
| Current Rating (Amps) | 0.5A per Contact | |
| Insulation Height | 0.268 6.80mm | |
| Style | Board to Cable/Wire | |
| Number of Positions Loaded | All | |
| Pitch - Mating | 0.020 0.50mm | |
| Insulation Color | Black | |
| Contact Finish - Post | Tin | |
| Features | Board Guide, Solder Retention | |
| Contact Finish Thickness - Mating | 30.0μin 0.76μm | |
| Stack Height (Mating) | 8.5mm | |
| Material Flammability Rating | UL94 V-0 |
FI-TD44SB-VF85-R750 Документы
- PCN Obsolescence/ EOLMultiple Devices 28/Feb/2017
- DatasheetsFI-TD44SB-VF85-R750 Drawing
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