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- MM70-314B2-1-R500
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MM70-314B2-1-R500 Технические параметры
JAE Electronics MM70-314B2-1-R500 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Card Edge Connectors - Edgeboard Connectors | |
| Марка | ||
| Factory Lead Time | 14 Weeks | |
| Contact Plating | Gold | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount, Right Angle | |
| Number of Pins | 314Pins | |
| Material - Insulation | Liquid Crystal Polymer (LCP), Glass Filled | |
| Manufacturer Package Identifier | MM70-314B2-1-R500 | |
| Contact Materials | Copper Alloy | |
| Operating Temperature | -40°C~85°C | |
| Packaging | Tape & Reel (TR) | |
| Series | MM70 | |
| Published | 2008 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Solder |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Number of Positions | 314Positions | |
| Max Operating Temperature | 85°C | |
| Min Operating Temperature | -40°C | |
| Color | Black | |
| Number of Rows | 2Rows | |
| Gender | Female | |
| Pitch | 0.020 0.50mm | |
| Current Rating | 500mA | |
| Contact Finish | Gold | |
| Number of Contacts | 314Contacts | |
| Card Type | MXM 3.0 | |
| Read Out | Dual | |
| Height | 4.5mm | |
| Contact Finish Thickness | 11.8μin 0.30μm | |
| Card Thickness | 0.047 1.20mm | |
| RoHS Status | RoHS Compliant |
MM70-314B2-1-R500 Документы
- DatasheetsMM70-314B2-x Drawing MM70 Series
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