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HX316LS9IB/8 Технические параметры

Kingston Technology  HX316LS9IB/8 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory Cards
Марка
ECCN (US) EAR99
HTS 8473.30.11.40
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 16Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 1600
Chip Configuration 512Mx8
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.28/1.425
Typical Operating Supply Voltage (V) 1.35/1.5
Maximum Operating Supply Voltage (V) 1.45/1.575
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Module Sides Double
ECC Support No
Свойство продукта Значение свойства
Number of Ranks DualRank
Number of Chip Banks 8Chip Banks
CAS Latency 9
SPD EEPROM Support No
Standard Package Name DIMM
Supplier Package SODIMM
Mounting Socket
Package Height 30
Package Length 67.6
PCB changed 204
Lead Shape No Lead
Part Status Active
Pin Count 204
Organization 1Gx64
PLL No
Self Refresh No
Module Type 204SODIMM
RoHS Status Yes with exemptions
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HX316LS9IB/8 Документы

HX316LS9IB/8 brand manufacturers: Kingston Technology, Anli stock, HX316LS9IB/8 reference price.Kingston Technology. HX316LS9IB/8 parameters, HX316LS9IB/8 Datasheet PDF and pin diagram description download.You can use the HX316LS9IB/8 Memory Cards, DSP Datesheet PDF, find HX316LS9IB/8 pin diagram and circuit diagram and usage method of function,HX316LS9IB/8 electronics tutorials.You can download from the Anli.