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HX318C10FRK2/8 Технические параметры
Kingston Technology HX318C10FRK2/8 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory Cards | |
| Марка | ||
| Lead Shape | No Lead | |
| PCB changed | 240 | |
| Package Length | 133.35 | |
| Package Height | 30 | |
| Mounting | Socket | |
| Supplier Package | DIMM | |
| Standard Package Name | DIM | |
| SPD EEPROM Support | No | |
| CAS Latency | 10 | |
| Number of Chip Banks | 8Chip Banks | |
| Number of Ranks | SingleRank | |
| ECC Support | No | |
| Module Sides | Single | |
| Maximum Operating Temperature (°C) | 85 | |
| Minimum Operating Temperature (°C) | 0 | |
| Maximum Operating Supply Voltage (V) | 1.575 | |
| Typical Operating Supply Voltage (V) | 1.5 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Minimum Operating Supply Voltage (V) | 1.425 | |
| Chip Package Type | FBGA | |
| Chip Configuration | 512Mx8 | |
| Maximum Clock Rate (MHz) | 1866 | |
| Data Bus Width (bit) | 64 | |
| Chip Density (bit) | 4G | |
| Number of Chip per Module | 16Chip per Modules | |
| Module Density | 8Gbyte | |
| Module | DRAM Module | |
| HTS | 8473.30.11.40 | |
| ECCN (US) | EAR99 | |
| Part Status | Active | |
| Pin Count | 240 | |
| Organization | 512Mx64x2 | |
| PLL | No | |
| Self Refresh | No | |
| Module Type | 240DIMM | |
| RoHS Status | Yes with exemptions |
HX318C10FRK2/8 Документы
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