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HX430C15PB3AK2/32 Технические параметры

Kingston Technology  HX430C15PB3AK2/32 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory Cards
Марка
ECCN (US) EAR99
Module DRAM Module
Module Density 32Gbyte
Number of Chip per Module 16Chip per Modules
Chip Density (bit) 8G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 3000
Chip Configuration 1Gx8
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.2
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 70
Module Sides Double
Свойство продукта Значение свойства
ECC Support No
Number of Ranks DualRank
CAS Latency 15
Supplier Package DIMM
Mounting Socket
Package Height 42.2
Package Length 133.35
Package Width 8
PCB changed 288
Part Status Active
Pin Count 288
Organization 4Gx64
Self Refresh Yes
Module Type 288DIMM
RoHS Status Supplier Unconfirmed
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HX430C15PB3AK2/32 Документы

HX430C15PB3AK2/32 brand manufacturers: Kingston Technology, Anli stock, HX430C15PB3AK2/32 reference price.Kingston Technology. HX430C15PB3AK2/32 parameters, HX430C15PB3AK2/32 Datasheet PDF and pin diagram description download.You can use the HX430C15PB3AK2/32 Memory Cards, DSP Datesheet PDF, find HX430C15PB3AK2/32 pin diagram and circuit diagram and usage method of function,HX430C15PB3AK2/32 electronics tutorials.You can download from the Anli.