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KSM24SES8/8ME Технические параметры

Kingston Technology  KSM24SES8/8ME technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory Cards
Марка
ECCN (US) EAR99
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 9Chip per Modules
Chip Density (bit) 8G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 2400
Chip Configuration 1Gx8
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.2
Operating Current (mA) 1305
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Свойство продукта Значение свойства
ECC Support Yes
Number of Ranks SingleRank
CAS Latency 17
Supplier Package SODIMM
Mounting Socket
Package Height 30
Package Length 69.6
Package Width 3.7(Max)
PCB changed 260
Part Status Obsolete
Pin Count 260
Organization 1Gx72
Module Type 260SODIMM
RoHS Status Yes with exemptions
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KSM24SES8/8ME Документы

KSM24SES8/8ME brand manufacturers: Kingston Technology, Anli stock, KSM24SES8/8ME reference price.Kingston Technology. KSM24SES8/8ME parameters, KSM24SES8/8ME Datasheet PDF and pin diagram description download.You can use the KSM24SES8/8ME Memory Cards, DSP Datesheet PDF, find KSM24SES8/8ME pin diagram and circuit diagram and usage method of function,KSM24SES8/8ME electronics tutorials.You can download from the Anli.