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KSM26RD8/32MEI Технические параметры

Kingston Technology  KSM26RD8/32MEI technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory Cards
Марка
ECCN (US) 4A994.a
HTS 8473.30.11.40
Module DRAM Module
Module Density 32Gbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 16G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 2666
Chip Configuration 2Gx8
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.2
Operating Current (mA) 1656
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Module Sides Double
Свойство продукта Значение свойства
ECC Support Yes
Number of Ranks DualRank
CAS Latency 19
SPD EEPROM Support No
Supplier Package RDIMM
Mounting Socket
Package Height 31.25
Package Length 133.35
PCB changed 288
Part Status Active
Pin Count 288
Organization 4Gx72
PLL No
Self Refresh Yes
Module Type 288RDIMM
RoHS Status RoHS Compliant

KSM26RD8/32MEI Документы

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