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KSM26RS4/16MEI Технические параметры

Kingston Technology  KSM26RS4/16MEI technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory Cards
Марка
ECCN (US) EAR99
HTS 8473.30.11.40
Module DRAM Module
Module Density 16Gbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 8G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 2666
Chip Configuration 2Gx4
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.2
Operating Current (mA) 2358
Minimum Operating Temperature (°C) 0
Свойство продукта Значение свойства
Maximum Operating Temperature (°C) 85
ECC Support Yes
Number of Ranks SingleRank
CAS Latency 19
Supplier Package RDIMM
Mounting Socket
Package Height 31.25
Package Length 133.35
PCB changed 288
Part Status Obsolete
Pin Count 288
Organization 2Gx72
Module Type 288DIMM
RoHS Status RoHS Compliant
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KSM26RS4/16MEI Документы

KSM26RS4/16MEI brand manufacturers: Kingston Technology, Anli stock, KSM26RS4/16MEI reference price.Kingston Technology. KSM26RS4/16MEI parameters, KSM26RS4/16MEI Datasheet PDF and pin diagram description download.You can use the KSM26RS4/16MEI Memory Cards, DSP Datesheet PDF, find KSM26RS4/16MEI pin diagram and circuit diagram and usage method of function,KSM26RS4/16MEI electronics tutorials.You can download from the Anli.