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KSM26RS8/8MEI Технические параметры

Kingston Technology  KSM26RS8/8MEI technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory Cards
Марка
ECCN (US) EAR99
HTS 8473.30.11.40
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 9Chip per Modules
Chip Density (bit) 8G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 2666
Chip Configuration 1Gx8
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.2
Operating Current (mA) 1404
Minimum Operating Temperature (°C) 0
Свойство продукта Значение свойства
Maximum Operating Temperature (°C) 85
ECC Support Yes
Number of Ranks SingleRank
CAS Latency 19
Supplier Package RDIMM
Mounting Socket
Package Height 31.25
Package Length 133.35
PCB changed 288
Part Status Obsolete
Pin Count 288
Organization 1Gx72
Module Type 288DIMM
RoHS Status RoHS Compliant
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KSM26RS8/8MEI Документы

KSM26RS8/8MEI brand manufacturers: Kingston Technology, Anli stock, KSM26RS8/8MEI reference price.Kingston Technology. KSM26RS8/8MEI parameters, KSM26RS8/8MEI Datasheet PDF and pin diagram description download.You can use the KSM26RS8/8MEI Memory Cards, DSP Datesheet PDF, find KSM26RS8/8MEI pin diagram and circuit diagram and usage method of function,KSM26RS8/8MEI electronics tutorials.You can download from the Anli.