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KVR1333D3E9S/8G Технические параметры

Kingston Technology  KVR1333D3E9S/8G technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory Cards
Марка
Mount Socket
Number of Pins 240Pins
ECCN (US) EAR99
Module DRAM Module
Module Density 8Gbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 1333
Chip Configuration 512Mx8
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.425
Typical Operating Supply Voltage (V) 1.5
Maximum Operating Supply Voltage (V) 1.575
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Module Sides Double
ECC Support Yes
Number of Ranks DualRank
Number of Chip Banks 8Chip Banks
CAS Latency 9
PC Type PC3-10600
Свойство продукта Значение свойства
SPD EEPROM Support No
Standard Package Name DIM
Supplier Package DIMM
Mounting Socket
Package Height 30
Package Length 133.35
PCB changed 240
Lead Shape No Lead
Number of Elements 18 Elements
RoHS Compliant
Part Status Obsolete
Max Operating Temperature 85 °C
Min Operating Temperature 0 °C
Pin Count 240
Operating Supply Voltage 1.5 V
Max Supply Voltage 1.575 V
Min Supply Voltage 1.425 V
Organization 1Gx72
Max Frequency 1.333 GHz
PLL No
Self Refresh No
Module Type 240DIMM
RoHS Status Yes with exemptions
Radiation Hardening No

KVR1333D3E9S/8G Документы

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