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KVR13E9/2I Технические параметры

Kingston Technology  KVR13E9/2I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory Cards
Марка
ECCN (US) EAR99
HTS 8542.32.00.02
Module DRAM Module
Module Density 2Gbyte
Number of Chip per Module 9Chip per Modules
Chip Density (bit) 2G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 1333
Chip Configuration 256Mx8
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.425
Typical Operating Supply Voltage (V) 1.5
Maximum Operating Supply Voltage (V) 1.575
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Module Sides Single
ECC Support Yes
Свойство продукта Значение свойства
Number of Ranks SingleRank
Number of Chip Banks 8Chip Banks
CAS Latency 9
PC Type PC3-10600
SPD EEPROM Support No
Standard Package Name DIM
Supplier Package DIMM
Mounting Socket
Package Height 30
Package Length 133.35
PCB changed 240
Lead Shape No Lead
Part Status Obsolete
Pin Count 240
Organization 256Mx72
PLL No
Self Refresh No
Module Type 240DIMM
RoHS Status Supplier Unconfirmed

KVR13E9/2I Документы

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