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- KVR24S17S8/8
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KVR24S17S8/8 Технические параметры
Kingston Technology KVR24S17S8/8 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory Cards | |
| Марка | ||
| Factory Lead Time | 4 Weeks, 2 Days | |
| Surface Mount | NO | |
| Number of Terminals | 260Terminals | |
| ECCN (US) | EAR99 | |
| Module | DRAM Module | |
| Module Density | 8Gbyte | |
| Number of Chip per Module | 8Chip per Modules | |
| Chip Density (bit) | 8G | |
| Data Bus Width (bit) | 64 | |
| Maximum Clock Rate (MHz) | 2400 | |
| Chip Configuration | 1Gx8 | |
| Chip Package Type | FBGA | |
| Typical Operating Supply Voltage (V) | 1.2 | |
| Minimum Operating Temperature (°C) | 0 | |
| Maximum Operating Temperature (°C) | 85 | |
| Module Sides | Double | |
| ECC Support | No | |
| Number of Ranks | SingleRank | |
| CAS Latency | 17 | |
| PC Type | PC4-2400 | |
| SPD EEPROM Support | Yes | |
| Standard Package Name | DIM | |
| Supplier Package | SODIMM | |
| Mounting | Socket | |
| Package Height | 30 | |
| Package Length | 69.6 | |
| Package Width | 3.7(Max) | |
| PCB changed | 260 | |
| Lead Shape | No Lead | |
| Package Description | DIMM, | |
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Number of Words Code | 1000000000Words Codes | |
| Package Body Material | UNSPECIFIED | |
| Reflow Temperature-Max (s) | NOT SPECIFIED |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Operating Temperature-Max | 85 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | KVR24S17S8/8 | |
| Number of Words | 1073741824 wordsWord | |
| Supply Voltage-Nom (Vsup) | 1.2 V | |
| Package Code | DIMM | |
| Package Shape | RECTANGULAR | |
| Manufacturer | Kingston Technology Company | |
| Part Life Cycle Code | Contact Manufacturer | |
| Ihs Manufacturer | KINGSTON TECHNOLOGY COMPANY INC | |
| Risk Rank | 5.69 | |
| Part Status | LTB | |
| Additional Feature | AUTO/SELF REFRESH; SEATED HGT-NOM; WD-MAX | |
| Technology | CMOS | |
| Terminal Position | DUAL | |
| Terminal Form | NO LEAD | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Reach Compliance Code | compliant | |
| Pin Count | 260 | |
| JESD-30 Code | R-XDMA-N260 | |
| Temperature Grade | OTHER | |
| Number of Ports | 1Port | |
| Operating Mode | SYNCHRONOUS | |
| Organization | 1Gx64 | |
| Seated Height-Max | 30 mm | |
| Memory Width | 64 | |
| Memory Density | 68719476736 bit | |
| PLL | No | |
| Memory IC Type | DDR DRAM MODULE | |
| Access Mode | SINGLE BANK PAGE BURST | |
| Self Refresh | Yes | |
| Module Type | 260SODIMM | |
| Width | 3.7 mm | |
| Length | 69.6 mm | |
| RoHS Status | RoHS Compliant |
KVR24S17S8/8 Документы
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