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Laird Thermal Materials A10222-02 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Thermal - Pads, Sheets | |
| Марка | ||
| Material | Boron Nitride Filled | |
| Shape | Square | |
| RoHS | Details | |
| Factory Pack QuantityFactory Pack Quantity | 6 | |
| Tradename | Tpli | |
| Package | Bulk | |
| Mfr | Laird Technologies - Thermal Materials | |
| Product Status | Active | |
| Series | Tpli 200 | |
| Packaging | Bulk | |
| Type | Gap Filler Pad, Sheet |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Color | - | |
| Usage | - | |
| Shelf Life | 24 Months | |
| Adhesive | Adhesive - One Side | |
| Storage/Refrigeration Temperature | - | |
| Shelf Life Start | Date of Shipment | |
| Backing, Carrier | - | |
| Outline | 203.20mm x 203.20mm | |
| Thermal Conductivity | 6.0W/m-K | |
| Product | Thermally Conductive Gap Pad | |
| Thermal Resistivity | - | |
| Thickness | 0.0390 (0.991mm) |