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Laird Thermal Materials OTH-Q119007N-00-D5 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Thermal - Pads, Sheets | |
| Марка | ||
| Material | Ceramic Filled Silicone Free | |
| RoHS | Details | |
| Minimum Operating Temperature | - 25 C | |
| Maximum Operating Temperature | + 120 C | |
| Designed for | Chipsets, Microprocessors | |
| Factory Pack QuantityFactory Pack Quantity | 50 | |
| Tradename | Tflex | |
| Unit Weight | 0.160493 oz | |
| Series | SF800 |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Packaging | Bulk | |
| Type | Silicone-Free Gap Filler | |
| Color | Gray | |
| Thermal Conductivity | 7.8 W/m-K | |
| Product | Thermal Gap Filler | |
| Thermal Resistance | 50 C/W | |
| Length | 55 mm | |
| Width | 40 mm | |
| Thickness | 0.203 mm | |
| Flammability Rating | UL 94 V-0 |