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OTH-Q119007N-00-D5 Технические параметры

Laird Thermal Materials  OTH-Q119007N-00-D5 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Thermal - Pads, Sheets
Марка
Material Ceramic Filled Silicone Free
RoHS Details
Minimum Operating Temperature - 25 C
Maximum Operating Temperature + 120 C
Designed for Chipsets, Microprocessors
Factory Pack QuantityFactory Pack Quantity 50
Tradename Tflex
Unit Weight 0.160493 oz
Series SF800
Свойство продукта Значение свойства
Packaging Bulk
Type Silicone-Free Gap Filler
Color Gray
Thermal Conductivity 7.8 W/m-K
Product Thermal Gap Filler
Thermal Resistance 50 C/W
Length 55 mm
Width 40 mm
Thickness 0.203 mm
Flammability Rating UL 94 V-0
OTH-Q119007N-00-D5 brand manufacturers: Laird Thermal Materials, Anli stock, OTH-Q119007N-00-D5 reference price.Laird Thermal Materials. OTH-Q119007N-00-D5 parameters, OTH-Q119007N-00-D5 Datasheet PDF and pin diagram description download.You can use the OTH-Q119007N-00-D5 Thermal - Pads, Sheets, DSP Datesheet PDF, find OTH-Q119007N-00-D5 pin diagram and circuit diagram and usage method of function,OTH-Q119007N-00-D5 electronics tutorials.You can download from the Anli.